نوشته شده توسط Super User دسته: Parker
نمایش از 08 آبان 1392 بازدید: 2463
پرینت

ADVANCED COOLING SYSTEMS

Using our patented Macrospray® macrolaminate technology and advanced material bonding techniques, the Gas Turbine Fuel Systems Division provides advanced cooling solutions for electronics. These solutions include traditional liquid flow through coldplate cooling systems, or more advanced designs incorporating single- and two-phase spray impingement solutions.

 

Our cooling systems utilize various proprietary components from Parker, including our advanced coldplates, smart pumps, and Macrospray nozzles. Not only do these innovative systems provide extreme heat removal, they give electronics designers the flexibility of working with more compact, conformal thermal solution packaging, permitting design in ways never before possible.

 

Our team can work with you to transition from traditional air and conduction cooling to a cost-effective liquid cooling system that meets your current and future cooling challenges efficiently and effectively.

 

Targeted Applications

 

  • Aircraft avionics
  • High-end computing
  • High-power lasers
  • Medical imaging equipment
  • Military ground vehicle electronics
  • Point-of-load converters
  • Power conversion and inversion
  • Power distribution
  • Radar and antennas
  • Telecommunications equipment
  • Unmanned aerial vehicles
  • Weapons systems
  • Technical Highlights

 

  • Self-contained, closed-loop systems containing coolant, control system, smart pump, filter, accumulator, heaters for cold-system startup, and various devise and board-level heat-absorbing technologies
  • Board-level thermal solutions, including liquid-flow-thru and spray cooled modules adapted to the particular application and performance requirements
  • Spray cooling solutions for extremely demanding heat removal applications (e.g. spray impingement and two phase cooling within 1” pitch modules)
  • System solutions utilizing a variety of liquid cooling methods for military and commercial electronics applications, enabling system integrators to achieve high compute and bandwidth density in the smallest volume possible
  • Systems adaptable to existing platform (vehicle) liquid systems
  • Standardized case sizes (ATR and ARINC 404/600) or custom chassis configurations
  • Thermal solutions accommodate various board types, including VITA standards for VME, VXS, and VPX (VITA 46/48) with scalable technology sized for the required amount of cooling in a particular application
  • Parker thermal solutions are capable of cooling up to a 1000 watts per individual board module with water or water/glycol coolants
  • Solutions designed to be two-level maintenance compatible; users can easily change out the electronics modules or the pump module without needing special conditions, tools, or specialized technical knowledge
  • Technology supports line-replaceable-unit (LRU) and line-replaceable-module (LRM) maintenance approach
  • Modular design approach allows the base electronics chassis to be used through several tech-refresh cycles even when changing from conduction to liquid cooling, considerably lowering the system’s total cost of ownership
  • Systems for ruggedized military and commercial aerospace implementation for shock, vibration, and acceleration requirements to MIL-STD-810F, EMI/EMC requirements to MIL-STD-461E, and operation from -40 to 85 degrees Celsius (storage to 125 degrees Celsius)
  • Operational from -1,500 to 70,000 feet altitude and compliant with the humidity, salt fog, fungal growth, thermal shock, sand, and dust requirements of VITA 47
  • Mechanical design and thermal analysis expertise, including finite element analysis and computational fluid dynamics
You are here:   HomePARKERSystems and TechnologiesFuel ManagementFuel Management SystemsADVANCED COOLING SYSTEMS